Laser braze ceramic to an implantable medical device housing

ABSTRACT

One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.

BACKGROUND

One aspect relates to a feedthrough device for an implantable medicaldevice. Feedthroughs establish an electrical connection between ahermetically sealed interior and an exterior of the medical device.Known implantable therapeutic devices include cardiac pacemakers ordefibrillators, which usually include a hermetically sealed metalhousing, which is provided with a connection body, also called header,on one side. Said connection body includes a connection socket forconnecting electrode leads. In this context, the connection socketincludes electrical contacts that serve to electrically connectelectrode leads to the control electronics in the interior of thehousing of the implantable therapeutic device—also called implantabledevice. An essential prerequisite for an electrical bushing of this typeis hermetic sealing with respect to the surroundings.

Accordingly, it needs to be made sure that the conducting wires that areintroduced into an insulation element and via which the electricalsignals proceed, are introduced into the insulation element without anygaps. In this context, it has proven to be disadvantageous that theconducting wires in general are made of a metal and need to beintroduced into a ceramic insulation element. In order to ensurelong-lasting connection between the two elements, the internal surfaceof the bore hole in the insulation element must be metallized forsoldering the conducting wires into them. Said metallization inside thebore hole in the insulation element has proven to be difficult to apply.Homogeneous metallization of the internal surface of the bore hole inthe insulation element can be ensured only by means of expensiveprocedures. Alternatively or in addition to, brazing may be used toconnect the wires to the insulation element. Both metallization andbrazing, however, can lead to leaks over time.

For these and other reasons there is a need for the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments andtogether with the description serve to explain principles ofembodiments. Other embodiments and many of the intended advantages ofembodiments will be readily appreciated as they become better understoodby reference to the following detailed description. The elements of thedrawings are not necessarily to scale relative to each other. Likereference numerals designate corresponding similar parts.

FIGS. 1A and 1B illustrate a feedthrough device in accordance with theprior art.

FIG. 2 illustrates a cross-sectional view of a feedthrough assembly inan implantable medical device in accordance with one embodiment.

FIGS. 3A-3C illustrate cross-sectional views of a feedthrough assemblypartially assembled into an implantable medical device in accordancewith one embodiment.

FIG. 3D illustrates a cross-sectional view of a feedthrough assemblyassembled into an implantable medical device in accordance with oneembodiment.

FIG. 4 illustrates a partial cross-sectional view of a feedthroughassembly in an implantable medical device in accordance with oneembodiment.

FIG. 5 illustrates a flow diagram of a method of forming a feedthroughassembly in accordance with one embodiment.

FIG. 6A illustrates a feedthrough assembly and an implantable medicaldevice in accordance with one embodiment.

FIG. 6B illustrates a cross-sectional view of a feedthrough assemblypartially assembled into an implantable medical device in accordancewith one embodiment.

FIG. 6C illustrates a cross-sectional view of a feedthrough assembly inan implantable medical device in accordance with one embodiment.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shownby way of illustration specific embodiments in which the invention maybe practiced. In this regard, directional terminology, such as “top,”“bottom,” “front,” “back,” “leading,” “trailing,” etc., is used withreference to the orientation of the Figure(s) being described. Becausecomponents of embodiments can be positioned in a number of differentorientations, the directional terminology is used for purposes ofillustration and is in no way limiting. It is to be understood thatother embodiments may be utilized and structural or logical changes maybe made without departing from the scope of the present invention. Thefollowing detailed description, therefore, is not to be taken in alimiting sense, and the scope of the present invention is defined by theappended claims.

It is to be understood that the features of the various exemplaryembodiments described herein may be combined with each other, unlessspecifically noted otherwise.

One embodiment is a method of coupling a feedthrough assembly to asurrounding case of an implantable medical device. The method providesan insulator having a plurality of conducting elements extendingtherethrough. The insulator with conducting elements is placed within anopening of a case, thereby defining a narrow space between the insulatorand the case. A braze preform is placed adjacent the insulator and casein the narrow space. The insulator is heated with a laser until thetemperature of the adjacent preform is raised above its melting pointsuch that it flows and fills the space between the insulator and thecase.

In one embodiment, the temperature of the preform is raised above itsmelting point by directing the laser exclusively at the case and theinsulator and not at the preform. In this way, by avoiding directing toomuch energy at the preforms, this creates a high-quality seal betweenthe feedthrough assembly and the case with the melted preform. If thelaser were to be directed at the preform, spattering of the material ofthe preforms will occur, such that the seal between the case andfeedthrough assembly can be compromised.

In one embodiment, the braze preform is place on a feature that isformed in the case or in the insulator, or in their combination. In oneembodiment, the feature is configured with a surface configured tosecurely hold the braze preform while it is heated by the laser. In thisway, the preform will stay in the correct position between the case andin the insulator so that its melting will fill the narrow spacetherebetween.

In one embodiment, the braze preform, the insulator, and the case arefirst heated in an oven or other heating apparatus prior to heating theinsulator with the laser. In this way, the heat from the laser does notneed to increase the temperature of the preform from room temperatureall the way up to its melting point, which would require significantlaser energy and could cause defects in some instances. For example, ifthe laser is used to increase the temperature all the way from roomtemperature to the melting point of the preform, the insulator at whichthe laser is directed may experience surface damage and cracking. In oneembodiment, the braze preform, the insulator, and the case are heated toat least 600-800° C. prior to heating the insulator with the laser. Inthat case, the heat from the laser only needs to increase thetemperature of the preforms from 600-800° C. to the melting temperatureof the preforms.

In one embodiment, the braze preform, the insulator, and the case areheated in a container, which is vacuum-sealed, prior to heating theinsulator with the laser. In one embodiment, the container is filledwith an inert gas while heating the braze preform, the insulator, andthe case in the container. In one embodiment, it is advantageous toleave the braze preform, the insulator, and the case in the containereven after it is heater therein, and then heating the insulator with alaser through a glass portion of the container while the insulator iswithin the container. In one embodiment, the vacuum-sealed and/or inertgas-filled container prevents oxidation of the case during heating.

In one embodiment, the insulator is heated with a laser on a surfaceopposite where the braze preform is placed, such that the braze preformis pulled toward the laser as it melts from the heat of the appliedlaser. In some cases this will help pull the molten braze through thenarrow space between the insulator and the case ensuring a filled andhermetic seal between them.

In one embodiment, an implantable medical device includes a feedthroughassembly comprising an insulator and a plurality of conducting elementsextending therethrough. A case is provided with an opening into whichthe feedthrough assembly is placed defining a narrow space therebetween.A braze material fills the narrow space, thereby hermetically sealingthe feedthrough assembly to the case. The medical device ischaracterized in that one of the feedthrough assembly and the casecomprise a feature configured to securely hold the braze and in that theimplantable medical device does not include a ferrule. In oneembodiment, the feature is a step in the case or feedthrough assemblydefining a surface on which the braze material is securely held. In thisway, the preform will stay in the correct position between the case andin the insulator so that its melting will fill the narrow spacetherebetween.

In one embodiment, the feedthrough assembly comprises a top surface thatis exterior to the case and the step has a surface that is parallel tothe top surface of the feedthrough assembly. This surface in the stepprovides an ideal flat surface on which the preform can sit, withoutsliding or moving, so that it can be melted into place. In oneembodiment, the narrow space between the feedthrough assembly and caseis no less than 10 μm and no more than 50 μm. This distance rangeprovides a good capillary action for the braze to fill the space andprovide a good seal.

In one embodiment, the insulator and plurality of conducting elementsare hermetically sealed together without solder or braze. In this way,the hermetic seal between the insulator and plurality of conductingelements is not compromised during the melting of the braze between thefeedthrough assembly and case. In one embodiment, this is achieved byusing cermet for the plurality of conducting elements.

In one embodiment, the medical device is characterized in that thefeedthrough assembly includes metallization on at least one surface inorder to control the dimensions of the braze. In one embodiment, it isadvantageous for the metallization on the feedthrough assembly tocontrol the braze dimensions such that it is at least 0.010 inches belowthe top surface of the feedthrough assembly and at least 0.010 inchesabove a bottom surface of the feedthrough assembly.

FIGS. 1A and 1B illustrate respective perspective and sectional views offeedthrough device 10, such as for an implantable medical device, inaccordance with the prior art. Feedthrough device 10 includes ferrule12, insulator 14 and feedthrough pins 16. Ferrule 12 is a frame-likestructure with an internal opening into which insulator 14 is formed andthrough which feedthrough pins 16 extend. Insulator 14 facilitatesfeedthrough pins 16 extending through the frame-like structure offerrule 12 in a non-conductive manner.

Ferrule 12 is configured to fit into an opening of a case for animplantable medical device and such that it can be tightly securedthereto in order to ensure a hermetic seal with respect to an internalspace of the medical device. Feedthrough pins 16 extend from within theinternal space of the case of the medical device to outside the device,thereby providing electrical connection from the inside to the outside,while maintaining a hermetic seal. Flanges 22 can be provided on ferrule12 to further aid in securing feedthrough device 10 to the opening ofthe case of the implantable medical device and ensuring its hermeticseal.

Typically, insulator 14 is a ceramic or glass material, while ferrule 12is metallic. Ferrule 12 is metallic so that it can be readily welded toa metallic case of the implantable medical device. In order for theceramic material of insulator 14 to be coupled to the metallic materialof ferrule 12, insulator 14 is typically “metalized” with metalizedcoating 20. Alternatively, a metallic braze is used to secure ceramicmaterial of insulator 14 to the metallic material of ferrule 12.Similarly, braze 18 is used to couple the ceramic material of insulator14 to feedthrough pins 16, which are metallic conductors.

Use of braze 18 to secure insulator 14 to feedthrough pins 16 and tosecure insulator 14 to ferrule 12, and/or the need for metalized coating20 to secure insulator 14 to ferrule 12 creates extra processing stepsand adds to the complication and expense of manufacturing feedthroughdevice 10. Such braze 18 and metallization 20 can also lead to leaks andfailure of a hermitic seal for feedthrough device 10.

FIG. 2 illustrates implantable medical device 100 in accordance with oneembodiment. Implantable medical device 100 includes feedthrough assembly102 and case 104. Feedthrough assembly 102 includes insulator 112 andconducting elements 114. In one embodiment, braze 110 is added betweenfeedthrough assembly 102 and case 104 in order to secure and sealfeedthrough assembly 102 to case 104. In one embodiment, feedthroughassembly 102 is sealed to case 104, such that an interior 120 of case104 is hermetically sealed relative to its exterior 122, without the useof a ferrule.

In one embodiment, conducting elements 114 of feedthrough assembly 102are an electrically conductive material such that they provide aconductive path from internal space 120 to external space 122 of case104. Insulator 112 is of a non-electrically conductive material suchthat there is no conductive connection among the conducting elements 114or between the conducting elements 114 and case 104. All of theinterfaces between insulator 112 and conducting elements 114 and betweeninsulator 112 and case 104 are sealed in such a way that a hermetic sealis maintained between internal space 120 and external space 122 of case104. In one embodiment, all of the interfaces between insulator 112 andconducting elements 114 are hermetically sealed without the use of brazeor solder, as will be more fully explained below.

Unlike feedthrough device 10 of FIG. 1, implantable medical device 100in accordance with the exemplary embodiment of FIG. 2 has no ferrule.Whereas ferrule 12 of feedthrough device 10 is metallic an easily weldedto a case, feedthrough assembly 102 has no ferrule and is insteaddirectly coupled to case 104 using braze 110 as will be discussed morefully below.

In one embodiment, feedthrough assembly 102 is assembled by forminginsulator 112 and conducting elements 114 in a first process. In oneembodiment, insulator 112 is a ceramic material, such as aluminum oxide(Al2O3), and conducting elements 114 are a cermet material.

In the context of one embodiment, the terms, “cermet” or“cermet-containing,” shall refer to all composite materials made ofceramic materials in a metallic matrix (binding agent). These arecharacterized by their particularly high hardness and wear resistance.The “cermets” and/or “cermet-containing” substances are cuttingmaterials that are related to hard metals, but contain no tungstencarbide hard metal and are produced by powder metallurgical means. Asintering process for cermets and/or the cermet-containing elementsproceeds just like with homogeneous powders with the exception that themetal is compacted more strongly at the same pressuring force ascompared to the ceramic material. The cermet-containing bearing elementhas a higher thermal shock and oxidation resistance than sintered hardmetals. In most cases, the ceramic components of the cermet are aluminumoxide (Al2O3) and zirconium dioxide (ZrO2), whereas niobium, molybdenum,titanium, cobalt, zirconium, chromium and platinum are conceivable asmetallic components.

The ceramic of insulator 112 can be, for example, a multi-layer ceramicsheet into which a plurality of vias is introduced. The cermet ofconducting elements 114 is then introduced into the vias. In oneembodiment, both materials are introduced in a green state, and as such,the combination is fired together. Accordingly, the joining of theinsulator 112 and conducting elements 114 forms a hermetic sealtherebetween without the use of braze or solder.

FIGS. 3A-3D illustrate cross sectional views illustrating one process tosecure feedthrough assembly 102 to case 104 in accordance with oneembodiment. FIG. 3A illustrates feedthrough assembly 102 placed withinan opening of case 104 in preparation for securing feedthrough assembly102 to case 104 in accordance with one embodiment. In one embodiment,case 104 is provided with features 116 adjacent the outside surface 102b of feedthrough 102. In one example, the feature is a step or jog incase 104 that defines a seating surface 117, which is substantiallyparallel to a top surface 102 a of feedthrough 102.

FIG. 3B illustrates feedthrough assembly 102 placed within an opening ofcase 104 in a further step of securing feedthrough assembly 102 to case104 in accordance with one embodiment. Here, preforms 110 a are placedbetween the outside surface 102 b and case 104. In one example, preforms110 a are placed on features 116 so that they are steadily secured forthe further process. For example, preforms 110 a may be placed onseating surface 117. Once preforms 110 a are in place, lasers 140 and141 are directed at feedthrough 102 and activated. In one embodiment,lasers 140 and 141 are scanned across insulator 112, and particularlytoward outside surface 102 b, in order to heat up the ceramic in thatarea. In addition, preforms 110 a are placed so that they are closelyproximate to the outside surface 102 b of feedthrough 102. As such,preforms 110 a will begin to heat up from the adjacent heat frominsulator 112.

In one embodiment, preforms 110 a are gold braze placed relatively closeto outside surface 102 b of feedthrough 102. In one embodiment, lasers140 and 141 heat feedthrough 102 to a temperature high enough so as toinduce a temperature in preforms 110 a above the melting point of gold.As such, preforms 110 a will begin to melt and flow from the hightemperature caused by activated lasers 140 and 141.

In one embodiment, two lasers 140 and 141 are used, but in otherembodiments a single laser is used. In yet other embodiments, additionallasers are used to heat feedthrough 102. In some embodiments, the lasersare directed toward outside surface 102 b to ensure it is heated andwill therefore transfer heat effectively to preforms 110 a. In otherembodiments, lasers 140 and 141 scan the entire top surface offeedthrough 102 to heat the entire feedthrough 102. In yet otherembodiments, lasers 140 and 141 scan the entire device, including case104, preforms 110 a, and feedthrough assembly 102. In most instances,however, lasers 140 and 141 are not directed exclusively at preforms 110a, because if too much energy is focused directly at preforms 110 aspattering of the material of preforms 110 a will occur. In thatsituation, the seal between case 104 and feedthrough assembly 102 can becompromised.

Furthermore, although lasers 140 and 141 are illustrated “above”(relative to how illustrated in FIG. 3B) top surface 102 a offeedthrough 102, they can also be located “below” feedthrough 102 suchthat they would be directed at lower surface 102 c of feedthrough 102.In one embodiment, directing lasers at the lower surface 102 c aids indrawing the melted material of preforms 110 a toward the laser, therebyfilling the space defined between outside surface 102 b of feedthrough102 and the adjacent portions of case 104.

FIG. 3C illustrates feedthrough assembly 102 placed within case 104 in afurther step of securing feedthrough assembly 102 to case 104 inaccordance with one embodiment. Here, molten preforms 110 b areillustrated flowing in the space between outside surface 102 b offeedthrough 102 and case 104, having been subjected to heat offeedthrough assembly 102 that was produced by lasers 140 and 141. Asheat continues to be produced from the lasers directed at feedthroughassembly 102, molten preforms 110 b flow and fill the space betweenfeedthrough 102 and case 104.

In one embodiment, the space defined between outside surface 102 b offeedthrough 102 and the adjacent portions of case 104 is controlled suchthat it remains relatively narrow in order to encourage good capillaryaction of molten preforms 110 b. In one embodiment, the space betweenoutside surface 102 b of feedthrough 102 and the adjacent portions ofcase 104 is maintained between 10-50 μm. Where molten preforms 110 b area gold braze, this distance range provides a good capillary action forthe braze to fill the space.

In one embodiment, lasers 140 and 141 are CO₂ lasers controlled to heatthe ceramic of insulator 112 to a high temperature above the meltingpoint of preforms 110 a. In one example, where preforms are gold braze,the lasers heat the insulator 112 well above the melting point of gold,that is, well above 1,064° C. In one embodiment, both the feedthroughassembly 102 and case 104 are preheated before application of laserenergy from lasers 140 and 141, such as for example, in an oven. In oneexample, feedthrough assembly 102 and case 104 are preheated to atemperature of 600-800° C. before application of energy from lasers 140and 141. In this way, less heating energy is needed from lasers 140 and141 to melt preforms 110 a. In some cases, if lasers 140 and 141 areused without first preheating in order to melt preforms 110 a, such asall the way from room temperature, surface damage to insulators 112 canresult because the energy needed from lasers 140 and 141 is much greaterto maintain a high temperature to melt preforms 110 a.

In one embodiment, feedthrough assembly 102, case 104 and preforms 110 aare heated in a vacuum or in an inert gas. For example, feedthroughassembly 102, case 104 and preforms 110 a are heated in argon gas inorder to prevent oxidation of case 104, which is in one example,titanium. In one embodiment, feedthrough assembly 102, case 104 andpreforms 110 a are maintained in the vacuum or inert gas even duringlaser heating from lasers 140 and 141. In one embodiment, a vacuum/gascontrolled sealed container or box is provided for heating feedthroughassembly 102, case 104 and preforms 110 a. In one example, the boxincludes a window through which lasers 140 and 141 are directed in orderto transmit light through to the feedthrough assembly 102, case 104and/or preforms 110 a.

Because conducting elements 114 are cermet embedded adjacent ceramicinsulator 112, a hermetic seal therebetween is established without theuse of braze or solder. In one embodiment, this assures that even wherethe entire feedthrough assembly 102 is heated to high temperatures,there is no concern of braze or solder reflowing, as there would be forconventional feedthrough assemblies (such as in FIGS. 1A-1B) that mustuse braze of solder to achieve a hermitic seal between conductors andinsulator. In the case of these prior feedthrough assemblies, heatingwith lasers 140 and 141 would very likely reflow the braze or solderthat secures the insulator 14 to the feedthrough pins 16, therebyjeopardizing the hermetic seal.

FIG. 3D illustrates implantable medical device 100 including feedthroughassembly 102 secured within case 104 in accordance with one embodiment.Here, molten preforms 110 b have solidified as energy from lasers 140and 141 have been discontinued, thereby ending the heating offeedthrough assembly and allowing braze 110 to solidify as it cools. Inthis way, implantable medical device 100 has feedthrough assembly 102hermetically sealed directly to case 104 without requiring a ferrule,such as was needed for prior designs, such as feedthrough device 10 ofFIGS. 1A-1B

In one embodiment, braze 110 is controlled relative to feedthroughassembly 102 and case 104 in order to optimize its final configuration.FIG. 4 illustrates a portion of feedthrough assembly 102, specificallythe area between outside surface 102 b of feedthrough assembly 102 andcase 104. Here, a portion of outside surface 102 b, along the surface ofinsulator 112, includes metallization 115. In one embodiment,metallization 115 is applied before preforms 110 a are inserted andmelted. Metalizing outer surface 102 b allows molten preforms 110 b to“wet” to outer surface 102 b. In addition, in one embodiment,metallization 115 acts as a braze stop, so as to control the flow ofmolten preforms 110 b. By positioning metallization 115 in the desiredlocations, the final position of braze 110 is controlled, includingwhere braze 110 will stop, thereby defining the final dimensions ofbraze 110.

In this way, in one embodiment metallization 115 is stepped backslightly from the top and bottom surfaces 102 a and 102 c of feedthroughassembly 102 such that braze 110 will accordingly also be slightlyoffset. In one embodiment, metallization 115, and accordingly braze 110,is controlled to be 0.010 inches below the top surface 102 a offeedthrough assembly 102 and 0.010 inches above the bottom surface 102 cof feedthrough assembly 102. In one embodiment, this offset forms asuperior seal between feedthrough assembly 102 and case 104.

FIG. 5 is a flow diagram illustrating a process 200 of making afeedthrough assembly in accordance with one embodiment. In a first step210, a feedthrough assembly is introduced into a case of an implantablemedical device. In one embodiment, a relatively small space is leftbetween the feedthrough assembly and the case. At step 220, a preform isintroduced into the small space between the feedthrough assembly and thecase. In one embodiment, either the case or the feedthrough assembly, ortheir combination, have a feature on which the preform can be placed ina secure manner.

At step 230, a laser is scanned over the surface of the insulator of thefeedthrough assembly in order to bring up the temperature of theinsulator. In one embodiment, the insulator is immediately adjacent thepreform such that heating the insulator also heats the preform. In oneembodiment, the laser is controlled to heat the ceramic a temperatureabove the melting point of the preforms. In one embodiment, wherepreforms are gold braze, the laser heat the insulator well above 1,064°C. In one embodiment, each of the feedthrough assembly, the case and thepreform are first preheated before application of laser energy. In oneexample, the feedthrough assembly, case and preform are preheated to atemperature of 600-800° C. before application of energy from the laser.

At step 240, the laser continues to heat the feedthrough assembly, andin some instances the case and preform as well, such that the preformflows into the space between the feedthrough assembly and case. Once thespace is filled, the laser is deactivated such that the molten preformsolidifies thereby securing the feedthrough assembly to the case.

FIGS. 6A-6C illustrate cross sectional views illustrating one process tosecure feedthrough assembly 302 to case 304 in accordance with oneembodiment. FIG. 6A illustrates feedthrough assembly 302 placed withinan opening of case 304 in preparation for securing feedthrough assembly302 to case 304 in accordance with one embodiment. In one embodiment,feedthrough assembly 302 is provided with features 316 on the outsidesurface 302 b of feedthrough 302. In one example, the feature 316 is astep or jog in feedthrough assembly 302 that defines a seating surface317, which is substantially parallel to a top surface 302 a offeedthrough 302.

FIG. 6B illustrates feedthrough assembly 302 placed within an opening ofcase 304 in a further step of securing feedthrough assembly 302 to case304 in accordance with one embodiment. In one embodiment, preforms 310 aare placed between the outside surface 302 b and case 304. In oneexample, preforms 310 a are placed on features 316 so that they aresteadily secured for the further process. For example, preforms 310 amay be placed on seating surface 317.

In one embodiment, feedthrough assembly 302, case 304, and preforms 310a are all secured and heated in sealed container 400. In one example,container 400 is vacuum-sealed and in another it is filled with an inertgas, such as argon. In one embodiment, container 400 includes window 402through which lasers 340 and 341 are directed to heat feedthroughassembly 302, case 304 and/or preforms 310 a. Once preforms 310 a are inplace, lasers 340 and 341 are directed at feedthrough 302 and activated.In one embodiment, lasers 340 and 341 are scanned across insulator 312,and particularly toward outside surface 302 b, in order to heat up theceramic in that area. In addition, preforms 310 a are placed so thatthey are closely proximate to the outside surface 302 b of feedthrough302. As such, preforms 310 a will begin to heat up from the adjacentheat from insulator 312.

In one embodiment, preforms 310 a are gold braze placed relatively closeto outside surface 302 b of feedthrough 302. In one embodiment, lasers340 and 341 heat feedthrough 302 to a temperature high enough so as toinduce a temperature in preforms 310 a above the melting point of gold.As such, preforms 310 a will begin to melt and flow from the hightemperature.

As with the embodiment described above, a single laser, or two or morelasers may be used. Also, the lasers can be directed toward outsidesurface 302 b or can scan the entire top surface of feedthrough 302.Similarly to the previous embodiment, lasers can be directed at topsurface 302 b or directed at lower surface 302 c of feedthrough 302.

FIG. 6C illustrates implantable medical device 300 including feedthroughassembly 302 secured within case 304 in accordance with one embodiment.Here, molten preforms 310 b have solidified as energy from lasers 340and 341 have been discontinued, thereby ending the heating offeedthrough assembly 302 and allowing braze 310 to solidify as it cools.In this way, implantable medical device 300 has feedthrough assembly 302hermetically sealed directly to case 304 such that an interior 320 ofcase 304 is hermetically sealed relative to its exterior 322, withoutrequiring a ferrule as is needed for prior designs like feedthroughdevice 10 of FIGS. 1A-1B. Attaching feedthrough assembly 302 directly tocase 304 without the need of a ferrule simplifies the assembly processand steps, reduces parts and material, and reduces overall time andcost.

In one embodiment, implantable medical device 100 of FIG. 2 includescase 104 having feature 116 useful for holding preform 110 a, whileimplantable medical device 300 of FIG. 6C includes feedthrough assembly302 having feature 316 useful for holding preform 310 a. In yet otherembodiments, both the case and feedthrough assemblies can includefeatures, or their combinations define features, that are able to holdpreforms, which can then be subsequently heated and melted to form abraze that will hermetically seal the feedthrough assembly to the case.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

What is claimed is:
 1. A method of coupling a feedthrough assembly to asurrounding case of an implantable medical device comprising: providingan insulator having a plurality of conducting elements extendingtherethrough; placing the insulator with conducting elements within anopening of a case, thereby defining a narrow space between the insulatorand the case; placing a braze preform adjacent the insulator and case inthe narrow space; heating the insulator with a laser until raising thetemperature of the adjacent preform above its melting point such that itflows and fills the space between the insulator and the case.
 2. Themethod of claim 1 further comprising placing the braze preform on afeature that is formed in the case or in the insulator, or in theircombination.
 3. The method of claim 2, wherein the feature is configuredwith a surface configured to securely hold the braze preform while it isheated by the laser.
 4. The method of claim 1, wherein raising thetemperature of the adjacent preform above its melting point ischaracterized in that the laser is directed exclusively at the case andthe insulator and not directed at the preform.
 5. The method of claim 1further comprising heating the braze preform, the insulator, and thecase prior to heating the insulator with the laser.
 6. The method ofclaim 5 further comprising heating the braze preform, the insulator, andthe case prior to at least 600-800° C. prior to heating the insulatorwith the laser.
 7. The method of claim 5 further comprising heating thebraze preform, the insulator, and the case in a container, which isvacuum-sealed, prior to heating the insulator with the laser.
 8. Themethod of claim 7 further comprising filling the container with an inertgas while heating the braze preform, the insulator, and the case.
 9. Themethod of claim 7, wherein heating the insulator with a laser comprisesheating the insulator with a laser through a glass portion of thecontainer while the insulator is within the container.
 10. The method ofclaim 1, wherein heating the insulator with a laser comprises heatingthe insulator on a surface opposite where the braze preform is placedsuch that the braze preform is pulled toward the laser as it melts fromthe heat of the applied laser.
 11. An implantable medical devicecomprising: a feedthrough assembly comprising an insulator and aplurality of conducting elements extending therethrough; a case with anopening into which the feedthrough assembly is placed defining a narrowspace therebetween; a braze material filling the narrow space, therebyhermetically sealing the feedthrough assembly to the case; characterizedin that one of the feedthrough assembly and the case comprise a featureconfigured to securely hold the braze and in that the implantablemedical device does not include a ferrule.
 12. The implantable medicaldevice of claim 11, wherein the feature is a step in the case orfeedthrough assembly defining a surface on which the braze material issecurely held.
 13. The implantable medical device of claim 12, whereinthe feedthrough assembly comprises a top surface that is exterior to thecase and the step has a surface that is parallel to the top surface ofthe feedthrough assembly.
 14. The implantable medical device of claim11, wherein the narrow space is no less than 10 μm and no more than 50μm.
 15. The implantable medical device of claim 11, wherein theinsulator and plurality of conducting elements are hermetically sealedtogether without solder or braze.
 16. The implantable medical device ofclaim 15, wherein the plurality of conducting elements comprise cermet.17. The implantable medical device of claim 15, characterized in thatthe feedthrough assembly includes metallization on at least one surfaceto control the dimensions of the braze.
 18. The implantable medicaldevice of claim 17, wherein the metallization on the feedthroughassembly controls the braze such that it is at least 0.010 inches belowthe top surface of the feedthrough assembly and at least 0.010 inchesabove a bottom surface of the feedthrough assembly.